Micro Fabrication Facility Equipment
Wafer Cleaning & Wet Etching
3 wet hoods from Salare Systems in NC for solvent, acid & base etching and wafer cleaning
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Typical processes
- NMP resist strip
- RCA I & II cleaning
- Piranha resist strip (NanoStrip 2X also available)
- Chrome etch (CR-7)
- Tungsten etch
- Gold etch (GE 8148)
- Platinum etch (Aqua Regia)
- Nickel etch (HNO3 + Perfluoroalkyl Sulfonate)
Additional Wet hoods
- Sulfuric acid, Hydrogen Peroxide (Piranha Strip)
- Hydrochloric Acid & Hydrogen Peroxide (RCA II cleaning)
- Ammonium Hydroxide & Hydrogen Peroxide (RCA I cleaning)
- NMP, Acetone & Methanol (Solvents)
Resist Coating & Developing
Resist Coating Coater
- Semi-automated resist coater with an integrated hot plate
- 100mm tooling
Brewer Sciences Photo Resist Developer Tool
- Semi-automated wafer spin developer with an integrated hot plate
- 100mm tooling
UV Exposure
Nuetronix/Quintel 1X Contact/Proximity Printer
Model Q-7000-IR
- 365nm exposure wavelength
- Currently configured for 100mm wafers
- Mask tooling for 4, 5 and 7” masks
- Tooling available for 150mm wafers
- IR back-to-front alignment capable
GCA 5:1 Reduction i-line optical stepper
- 0.45na
- 365nm exposure wavelength
- Critical dimension (resolution) 0.5um
- Overlay 150nm XBar + 3 sigma
- Currently configured for 100mm dia. wafers, can expose up to 200mm wafers 0.25mm to 1.0mm thick
- Customized Tooling for exposing 5” X 5” X 0.150” photomasks
- Utilizes 5” X 5” reticles
- Processing of pieces/parts is possible with custom tooling
Plasma Etch
PlasmaTherm Versaline ICP
- Fluorine gases for SiO2 and Si & Ge etching as well as other semiconductor materials
- Configured for 100mm wafers up to 1mm thick
- RIE and or ICP modes
- Primarily used to dry etch SiO2 & Si films and bulk material
Oxford Instruments Plasmalab 100 ICP
- Utilizes CL2 & BCL3 etch chemistry for metal or dielectric etching
- Configured for 100mm wafers up to 1mm thick
- Tool can etch up to 10mm thick wafers with optional tooling
- RIE and or ICP modes
- Currently used to dry etch Sapphire & Chromium
Dielectric Conformal Deposition
Atomic Layer Deposition (ALD)
Oxford Instruments OPAL ALD tool utilizing the following pre-cursors:
- Diethyl zinc
- Tetrakis(ethylmethylamino) hafnium (IV)
- Titanium(IV) isopropoxide
- Trimethylaluminum
Metal & Dielectric Deposition
Electron Beam Deposition
- CCS CA-40 e-beam evaporator configured for 100mm wafers
Metals
- Gold
- Platinum
- Nickel
- Titanium
- Chromium
- Germanium
- Palladium
- Tantalum
- Iron
Dielectrics
- Tantalum Penta Oxide
- Silicon Dioxide
- Aluminum Dioxide
- Silicon Monoxide
- Titanium Dioxide
- Hafnium Oxide
Metrology
- Nikon Optical microscope magnification to 1500X
- Tencore Alpha Step 200 profilometer
- Hitachi S-4800 Scanning electron microscope access on-site at Clemson Universities EM facility
- Filmetrics F20 UV Optical thin-film measurement tool
Wafer Dicing
K&S Wafer Dicing Saw
- Model 780
- 200mm capable
- Cuts silicon, sapphire & optical glasses
Wire Bonding
K&S Wire Bonder
- Model 4525AD
- Gold wire 0.18um to 76um
- Man & Auto
- 152mm X 152mm area
Custom Tooling
Custom tooling fees are charged on a tool-by-tool basis depending on the complexity of design and material needed.